Imaging device, semiconductor manufacturing apparatus, and semiconductor manufacturing method

摘要

There are provided a susceptor having a recessed wafer mounting section, in which a semiconductor wafer is mounted and which is configured to include a circular bottom portion and a side wall portion, on an upper surface, a reaction chamber in which the susceptor is provided, an imaging unit that is provided above the reaction chamber and images the semiconductor wafer and the wafer mounting section, and an image analysis unit that analyzes the deviation of the semiconductor wafer from the wafer mounting section on the basis of an image captured by the imaging unit.

主权项

1. An imaging device comprising:
an imaging unit that images first and second objects placed in a reaction chamber of a semiconductor manufacturing apparatus; and an image analysis unit that analyzes deviation of each of the first and second objects from an appropriate arrangement position by measuring a distance between the first object and the second object on the basis of an image captured by the imaging unit; an image recording unit that records both the image captured by the imaging unit and a lot number of a semiconductor wafer; a display screen for displaying states of the first and second objects; a warning notification unit that gives a warning on the display screen when the deviation exceeds a predetermined value; and a setting screen for setting the predetermined value.