发明名称 Copper powder for conductive paste and method for producing same
摘要 There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
申请公布号 US9248504(B2) 申请公布日期 2016.02.02
申请号 US201113814891 申请日期 2011.09.12
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 Kaneshiro Yuki;Suenaga Shinichi;Fujita Hidefumi;Kishida Minoru
分类号 B22F9/24;B22F1/00;C22C9/00;H01B1/02;H01B1/22;C22C1/04;B82Y30/00 主分类号 B22F9/24
代理机构 Bachman & LaPointe, P.C. 代理人 Bachman & LaPointe, P.C.
主权项 1. A method for producing a copper powder for conductive paste, the method comprising the steps of: complexing copper by adding a complexing agent to an aqueous solution containing cuprous oxide or cupric oxide while blowing air into the solution; stopping the blowing of air after complexing copper; and thereafter, adding a reducing agent to the solution to deposit copper particles by reduction.
地址 Tokyo JP