发明名称 |
Copper powder for conductive paste and method for producing same |
摘要 |
There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction. |
申请公布号 |
US9248504(B2) |
申请公布日期 |
2016.02.02 |
申请号 |
US201113814891 |
申请日期 |
2011.09.12 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
Kaneshiro Yuki;Suenaga Shinichi;Fujita Hidefumi;Kishida Minoru |
分类号 |
B22F9/24;B22F1/00;C22C9/00;H01B1/02;H01B1/22;C22C1/04;B82Y30/00 |
主分类号 |
B22F9/24 |
代理机构 |
Bachman & LaPointe, P.C. |
代理人 |
Bachman & LaPointe, P.C. |
主权项 |
1. A method for producing a copper powder for conductive paste, the method comprising the steps of:
complexing copper by adding a complexing agent to an aqueous solution containing cuprous oxide or cupric oxide while blowing air into the solution; stopping the blowing of air after complexing copper; and thereafter, adding a reducing agent to the solution to deposit copper particles by reduction. |
地址 |
Tokyo JP |