| 摘要 |
The present invention relates to a sputtering method of a semiconductor package. The sputtering method comprises: a preparing step of preparing a double-sided adhesive means in which an adhesive layer and a cover layer are sequentially formed on a lower side and an upper side, individually, of a film, and a template in which a plurality of penetration holes are formed; a double-sided adhesive means attaching step of, after detaching a lower-side cover layer from the template, attaching the double-sided adhesive means to an upper surface of the template by using a lower-side adhesive layer; a double-sided adhesive means processing step of, after turning the template over to locate the double-sided adhesive means on a lower side of the template, cutting the film of the double-sided adhesive means and upper-side and lower-side adhesive layers through the penetration hole formed on the template to correspond to the penetration hole; a double-sided adhesive means hole formation step of forming a hole corresponding to the penetration hole of the template on the double-sided adhesive means by detaching the film and the upper-side and lower-side adhesive layers cut in the double-sided adhesive means processing step from the double-sided adhesive means by detaching an upper-side cover layer of the double-sided means; a semiconductor package attaching step of, after arranging the template to locate the template on a lower side of the double-sided adhesive means, placing and attaching the semiconductor package on and to an upper adhesive layer to locate a lower surface of the semiconductor package in a part corresponding to a hole of the double-sided adhesive means; a semiconductor package sputtering step of adhering the boundary of the lower surface the semiconductor package to the upper-side adhesive layer by using a sputtering apparatus, and coating five surfaces except for the lower surface of the semiconductor package by executing the sputtering of the semiconductor package; and a semiconductor package collection step for detaching the semiconductor package on which the five surfaces are coated from the upper-side adhesive layer to collect the semiconductor package. |
