Liquid ejection head in which positional relationships of elements are not affected by curing of bonding adhesive

摘要

A liquid ejection head includes an electrical wiring substrate and a printing element substrate, wherein the position variation of the printing element substrate due to curing of a sealing agent is eliminated. Specifically, a gap between two support members is covered with the electrical wiring substrate so as to be able to prevent a sealing agent from flowing into the gap. As a result, even in the case where the size of the gap varies due to the variation in the dimensional accuracy and/or the variation in the assembly accuracy, the sealing agent will not enter this gap, and therefore the shape thereof can be made substantially uniform regardless of the positions. This results in a substantially uniform stress in curing and contracting of the sealing agent, and the variation in the mounting position of the printing element substrate can be suppressed.

主权项

1. A liquid ejection head comprising:
a printing element substrate on which an ejection port for ejecting liquid is provided; a support member supporting the printing element substrate; another member arranged to be separated from the support member by a gap; an electrical wiring substrate that is provided to be extended over the support member and the other member and covers the gap; and an electrical connecting portion having a wiring to electrically connect with the printing element substrate, wherein the electrical connecting portion is sealed with a sealing agent.