Structural component and method for producing a structural component

摘要

The invention relates to a structural component which comprises a support (1), an optoelectronic semiconductor chip (2) having at least one lateral face (2a), further comprising a connecting means (3), a first molded element (4), and a second molded element (5), the optoelectronic semiconductor chip (2) being mechanically connected to the support (1) by the connecting means (3). The first molded element (4) covers an exposed outer face of the optoelectronic semiconductor chip (2) and the first molded element (4) covers an exposed outer face of the connecting means (3). The second molded element (5) covers an exposed outer face of the first molded element (5) and the second molded element (5) has a higher modulus of elasticity at room temperature than the first molded element.

主权项

1. A structural component comprising:
a carrier; an optoelectronic semiconductor chip having at least one side surface; a connecting means; a contact-making wire connected to the optoelectronic chip at its side facing away from the carrier; a first shaped body; and a second shaped body, wherein the optoelectronic semiconductor chip is mechanically connected to the carrier by means of the connecting means, the connecting means covers in places the side surface of the optoelectronic semiconductor chip and a surface of the carrier which faces the optoelectronic semiconductor chip, the connecting means is arranged directly between the optoelectronic semiconductor chip and the surface of the carrier which faces the optoelectronic semiconductor chip, the first shaped body covers an exposed outer surface of the optoelectronic semiconductor chip, the first shaped body covers an exposed outer surface of the connecting means, the second shaped body covers an exposed outer surface of the first shaped body, and the second shaped body has a higher modulus of elasticity at room temperature than the first shaped body.