A METHOD FOR FORMING A HIGH THERMAL SILVER NANO ADHESIVE

摘要

The present invention relates to a method for forming an adhesive to improve the electrical conductivity and thermal conductivity of the conductive adhesive used for electrical and electronic devices. The method for forming a high thermal silver nano adhesive comprises: a first step of synthesizing silver nanoparticles from silver nitrate (AgNO_3) through a chemical reaction; a second step of manufacturing a composite adhesive by mixing the silver nanoparticles with epoxy which is pyrolyzed in a range of 150 to 250°C; a third step of forming the composite adhesive between an adhesion target device and an adhesion object; and a fourth step of performing heat treatment on the composite adhesive formed between the adhesion target device and the adhesion object at 150°C for 20 to 40 minutes, performing the heat treatment at 150 to 250°C for 20 minutes to 1 hour to pyrolyze the epoxy, and performing the heat treatment at 250°C for 20 to 40 minutes to induce the metallic bond between the sliver nanoparticles. Therefore, the method of the present invention can provide a high thermal silver nano adhesive with significantly improved electrical conductivity and thermal conductivity by realizing the metallic bond between the silver nanoparticles after mixing the silver nanoparticles, which are synthesized through the chemical reaction, with the epoxy to manufacture the composite adhesive and pyrolyzing the epoxy.