发明名称 Optical sensing element arrangement with integral package
摘要 A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.
申请公布号 US9250126(B2) 申请公布日期 2016.02.02
申请号 US201213661274 申请日期 2012.10.26
申请人 Excelitas Technologies Singapore PTE. Ltd 发明人 Barlow Arthur John
分类号 G01J5/02;G01J1/46;G01J1/42;H05K13/00;H05K13/04;H05K3/32;G01J5/04;G01J5/20;G01J5/24;G01J5/08 主分类号 G01J5/02
代理机构 Sheehan Phinney Bass + Green PA 代理人 Nieves Peter A.;Sheehan Phinney Bass + Green PA
主权项 1. A sensor assembly comprising: a hollow casing having a radiation entrance opening; a radiation-transmissive optic at the radiation entrance opening, a substrate inside and sealed against an inner surface of the hollow casing; and an optical sensing element coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic, wherein the hollow casing is a single structure that extends from a top of the hollow casing around an edge of the radiation-transmissive optic down to a bottom of the portion of the hollow casing that contains a potting compound, and wherein a portion of the hollow casing that is adhered to an upper surface of the substrate thermally expands and contracts with a portion of the hollow casing that is adhered to an edge of the substrate.
地址 Singapore SG