发明名称 |
Optical sensing element arrangement with integral package |
摘要 |
A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed. |
申请公布号 |
US9250126(B2) |
申请公布日期 |
2016.02.02 |
申请号 |
US201213661274 |
申请日期 |
2012.10.26 |
申请人 |
Excelitas Technologies Singapore PTE. Ltd |
发明人 |
Barlow Arthur John |
分类号 |
G01J5/02;G01J1/46;G01J1/42;H05K13/00;H05K13/04;H05K3/32;G01J5/04;G01J5/20;G01J5/24;G01J5/08 |
主分类号 |
G01J5/02 |
代理机构 |
Sheehan Phinney Bass + Green PA |
代理人 |
Nieves Peter A.;Sheehan Phinney Bass + Green PA |
主权项 |
1. A sensor assembly comprising:
a hollow casing having a radiation entrance opening; a radiation-transmissive optic at the radiation entrance opening, a substrate inside and sealed against an inner surface of the hollow casing; and an optical sensing element coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic, wherein the hollow casing is a single structure that extends from a top of the hollow casing around an edge of the radiation-transmissive optic down to a bottom of the portion of the hollow casing that contains a potting compound, and wherein a portion of the hollow casing that is adhered to an upper surface of the substrate thermally expands and contracts with a portion of the hollow casing that is adhered to an edge of the substrate. |
地址 |
Singapore SG |