Composite substrate for light emitting diodes

摘要

A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.

主权项

1. A device comprising:
a substrate with a top surface and a bottom surface, wherein the substrate includes an insulating layer, a reflective layer and a thicker aluminum layer, and wherein the insulating layer and the reflective layer are disposed above the aluminum layer; and a printed circuit board having a layer of glass fiber in resin, a metal layer, a lower surface, and an upper surface, wherein the substrate is disposed in a hole in the printed circuit board, and wherein the lower surface of the printed circuit board and the bottom surface of the substrate are substantially coplanar.