SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The present invention is to provide a semiconductor device with a low height and low thermal resistance and a manufacturing method thereof. The semiconductor device comprises: a support plate (1); a semiconductor chip (2) which is mounted on one main surface of the support plate (1) with an adhesive layer interposed therebetween so that an element circuit surface faces upward; an insulation material layer (4) which seals the semiconductor chip (2) and surroundings thereof; an opening which is formed on an electrode disposed on the element circuit surface of the semiconductor chip (2) in the insulation material layer (4); a conductive portion (6) which is formed in the opening to be connected to the electrode of the semiconductor chip; a wiring layer (5) which is formed on the insulation material layer (4) to be connected to the conductive portion (6) and a part of which extends to a surrounding area of the semiconductor chip (2); and an external electrode (7) which is formed on the wiring layer (5), wherein the support plate (1) is a flat plate constituting a top layer of a complex support plate separated from the complex support plate formed by laminating multiple flat plates used in a manufacturing process of the semiconductor device.