Package for a MEMS sensor and manufacturing process thereof

摘要

A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.

主权项

1. A packaged device, comprising:
a first support structure that includes:
a first chamber;a first support layer; anda first wall layer coupled to the first support layer, the first wall layer and the first support layer delimiting the first chamber; a second support structure stacked on the first support structure, the second support structure including:
a second chamber;a second support layer; anda second wall layer coupled to the second support layer, the second wall layer and the second support layer delimiting the second chamber, the first chamber being delimited, at least in part, by the second support layer of the second support structure; a first die on the first support layer in the first chamber, the first die including a third chamber and a diaphragm having first and second sides, the first side of the diaphragm facing the third chamber and the second side of the diaphragm facing the first chamber; a first port through the first support layer and coupling the third chamber in fluid communication with an environment external to the packaged device; a second die on the second support layer in the second chamber; and a second port through the second support layer, the second port coupling the first chamber and second chamber in fluid communication, at least a portion of the first die being located directly below the second port.