发明名称 |
Self-aligned thin film transistor and fabrication method thereof |
摘要 |
Disclosed are a self-aligned thin film transistor capable of simultaneously improving an operation speed and stability and minimizing a size thereof by forming source and drain electrodes so as to be self-aligned, and a fabrication method thereof. The method of fabricating a thin film transistor according to an exemplary embodiment of the present disclosure includes: forming an active layer, a gate insulator, and a gate layer on a substrate; forming a photoresist layer pattern for defining a shape of a gate electrode on the gate layer; etching the gate layer, the gate insulator, and the active layer by using the photoresist layer pattern; depositing a source and drain layer on the etched substrate by a deposition method having directionality; and forming a gate electrode and self-aligned source electrode and drain electrode by removing the photoresist layer pattern. |
申请公布号 |
US9252241(B2) |
申请公布日期 |
2016.02.02 |
申请号 |
US201314031100 |
申请日期 |
2013.09.19 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
Oh Him Chan;Hwang Chi Sun;Park Sang Hee |
分类号 |
H01L29/66;H01L29/786;H01L29/45 |
主分类号 |
H01L29/66 |
代理机构 |
Rabin & Berdo, P.C. |
代理人 |
Rabin & Berdo, P.C. |
主权项 |
1. A method of fabricating a self-aligned thin film transistor, comprising:
forming on a substrate, an active layer, a gate insulator, and a gate layer; forming a photoresist layer pattern for defining a shape of a gate electrode on the gate layer; etching, by using the photoresist layer pattern, each of the gate layer, the gate insulator, and the active layer; after the etching, depositing a source and drain layer on the substrate by a deposition method having directionality; and forming the gate electrode and self-aligned source electrode and drain electrode by removing the photoresist layer pattern. |
地址 |
Daejeon KR |