发明名称 Self-aligned thin film transistor and fabrication method thereof
摘要 Disclosed are a self-aligned thin film transistor capable of simultaneously improving an operation speed and stability and minimizing a size thereof by forming source and drain electrodes so as to be self-aligned, and a fabrication method thereof. The method of fabricating a thin film transistor according to an exemplary embodiment of the present disclosure includes: forming an active layer, a gate insulator, and a gate layer on a substrate; forming a photoresist layer pattern for defining a shape of a gate electrode on the gate layer; etching the gate layer, the gate insulator, and the active layer by using the photoresist layer pattern; depositing a source and drain layer on the etched substrate by a deposition method having directionality; and forming a gate electrode and self-aligned source electrode and drain electrode by removing the photoresist layer pattern.
申请公布号 US9252241(B2) 申请公布日期 2016.02.02
申请号 US201314031100 申请日期 2013.09.19
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 Oh Him Chan;Hwang Chi Sun;Park Sang Hee
分类号 H01L29/66;H01L29/786;H01L29/45 主分类号 H01L29/66
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A method of fabricating a self-aligned thin film transistor, comprising: forming on a substrate, an active layer, a gate insulator, and a gate layer; forming a photoresist layer pattern for defining a shape of a gate electrode on the gate layer; etching, by using the photoresist layer pattern, each of the gate layer, the gate insulator, and the active layer; after the etching, depositing a source and drain layer on the substrate by a deposition method having directionality; and forming the gate electrode and self-aligned source electrode and drain electrode by removing the photoresist layer pattern.
地址 Daejeon KR