| 发明名称 | Device module | ||
| 摘要 | The invention provides a device module including a device, a connecting part, and a plastic part. The device is a sensor, an electronic component, or a circuit board. The connecting part is connected to the device and includes an external connecting portion. The device and the connecting part are embedded in the plastic part. The plastic part is provided with a first opening that exposes at least the external connecting portion of the connecting part to the outside. | ||
| 申请公布号 | US9253908(B2) | 申请公布日期 | 2016.02.02 |
| 申请号 | US201313760329 | 申请日期 | 2013.02.06 |
| 申请人 | HOSIDEN CORPORATION | 发明人 | Shinoda Koji;Isoda Takeshi |
| 分类号 | H05K7/00;H05K5/00;G06F3/044;H03K17/96;G06F1/16;G06F3/041 | 主分类号 | H05K7/00 |
| 代理机构 | Kratz, Quintos & Hanson, LLP | 代理人 | Kratz, Quintos & Hanson, LLP |
| 主权项 | 1. A device module comprising: a device being a sensor; an external connecting portion; a connecting part connected to the device and provided with the external connecting portion; and a plastic part molded of plastic material, the device and the connecting part being insert-molded in the plastic part, the plastic part being provided with a first opening that exposes at least the external connecting portion of the connecting part to the outside, wherein the connecting part is a flexible printed circuit board or flexible insulating film, wherein the connecting part has a substantially uniform thickness. | ||
| 地址 | Yao-shi JP | ||