发明名称 Independent gate vertical FinFET structure
摘要 A semiconductor device includes a substrate extending in a first direction to define a substrate length and a second direction perpendicular to the first direction to define a substrate width. A first semiconductor fin is formed on an upper surface of the substrate. The first semiconductor fin extends along the second direction at a first distance to define a first fin width. A first gate channel is formed between a first source/drain junction formed in the substrate and a second source/drain junction formed in the first semiconductor fin. A first gate stack is formed on sidewalls of the first gate channel. A first spacer is interposed between the first gate stack and the first source/drain junction.
申请公布号 US9252145(B2) 申请公布日期 2016.02.02
申请号 US201514803523 申请日期 2015.07.20
申请人 International Business Machines Corporation 发明人 Basker Veeraraghavan S.;Liu Zuoguang;Yamashita Tenko;Yeh Chun-chen
分类号 H01L27/088;H01L29/423;H01L29/10 主分类号 H01L27/088
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP ;Alexanian Vazken
主权项 1. A semiconductor device, comprising: a substrate extending in a first direction to define a substrate length and a second direction perpendicular to the first direction to define a substrate width; a first semiconductor fin formed on an upper surface of the substrate, the first semiconductor fin extending along the second direction a first distance to define a first fin width; a first gate channel formed between a first source/drain junction formed in the substrate and a second source/drain junction formed in the first semiconductor fin; a first gate stack formed on sidewalls of the first gate channel; and a first spacer interposed between the first gate stack and the first source/drain junction.
地址 Armonk NY US