Semiconductor die mount by conformal die coating

摘要

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

主权项

1. A method for affixing a die onto a support, comprising providing a first die having a conformal coating on a surface thereof, providing a support having a conformal coating on a surface thereof, contacting a die attach area of the conformal coating on the first die directly with a die mount region of the conformal coating on the support, wherein the conformal coatings on the surfaces of the die and the support are of polyxylylene polymer material, and accomplishing adhesion of the die attach area with the die mount region of the support by heating at least one of the die attach area of the conformal coating on the first die or the die mount region of the conformal coating on the support to a temperature sufficient to affect adhesion.