| 发明名称 | Package vias for radio frequency antenna connections | ||
| 摘要 | Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate. | ||
| 申请公布号 | US9252077(B2) | 申请公布日期 | 2016.02.02 |
| 申请号 | US201314037213 | 申请日期 | 2013.09.25 |
| 申请人 | Intel Corporation | 发明人 | Molzer Wolfgang;Goetz Edmund;Mahnkopf Reinhard;Memmler Bernd |
| 分类号 | H01L23/48 | 主分类号 | H01L23/48 |
| 代理机构 | Blakely, Sokoloff, Taylor & Zafman LLP | 代理人 | Blakely, Sokoloff, Taylor & Zafman LLP |
| 主权项 | 1. A package comprising: a package substrate; a die attached to the package substrate; a molding compound over the die and the package substrate forming the external surface of the package; an antenna on the external surface of the package; and a conductive via from the package substrate to the external surface of the package to make a radio frequency connection between the antenna and the package substrate, wherein the via has parallel concentric conducting paths isolated by a dielectric. | ||
| 地址 | Santa Clara CA US | ||