| 发明名称 | LED package | ||
| 摘要 | An LED package includes a package substrate, a first LED chip mounted on the package substrate, a first phosphor layer disposed on the first LED chip, a reflective layer configured to surround sides of the first LED chip and the first phosphor layer; and a mask disposed on the reflective layer and including a first opening portion which exposes a surface of the first phosphor layer. | ||
| 申请公布号 | US9252343(B2) | 申请公布日期 | 2016.02.02 |
| 申请号 | US201414521103 | 申请日期 | 2014.10.22 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Kim Kwon-Jin;Kim Hee-Dong;Park Hee-Seok;Wang Ji-Seok;Jo Yong-Kee |
| 分类号 | H01L33/00;H01L33/60;H01L27/15;H01L33/50 | 主分类号 | H01L33/00 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. An LED package, comprising: a package substrate; a first LED chip mounted on the package substrate; a first phosphor layer disposed on the first LED chip; a reflective layer configured to surround sides of the first LED chip and the first phosphor layer; and a mask disposed on the reflective layer and including a first opening portion which exposes a surface of the first phosphor layer, wherein at least one side of the first opening portion is adjacent to at least one edge of the first phosphor layer and extends parallel to the at least one edge of the first phosphor layer, and side surfaces of the reflective layer are vertically continuously aligned with side surfaces of the package substrate, and wherein at least a portion of the reflective layer is disposed on an upper surface of the first LED chip, and the first opening portion exposes the at least a portion of the reflective layer. | ||
| 地址 | Suwon-Si, Gyeonggi-Do KR | ||