发明名称 Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity
摘要 An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.
申请公布号 US9248509(B2) 申请公布日期 2016.02.02
申请号 US201414447557 申请日期 2014.07.30
申请人 APPLIED MATERIALS, INC. 发明人 Tavassoli Hamid;Kumar Surajit;Bera Kallol;Zhou Xiaoping;Nevil Shane C.;Buchberger, Jr. Douglas A.
分类号 B23K10/00;B23B31/28;H01L21/67;H01L21/683;H05H1/46;B23Q3/15 主分类号 B23K10/00
代理机构 Blakley, Sokoloff, Taylor & Zafman LLP 代理人 Blakley, Sokoloff, Taylor & Zafman LLP
主权项 1. A chuck assembly for supporting a workpiece during a manufacturing operation, the chuck assembly comprising: a top surface of a dielectric layer to support the workpiece; a cooling channel base disposed beneath the top surface; a base plate disposed beneath the cooling channel base; and a thermal break disposed within the cooling channel base and extending into the base plate.
地址 Santa Clara CA US