发明名称 |
Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity |
摘要 |
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance. |
申请公布号 |
US9248509(B2) |
申请公布日期 |
2016.02.02 |
申请号 |
US201414447557 |
申请日期 |
2014.07.30 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Tavassoli Hamid;Kumar Surajit;Bera Kallol;Zhou Xiaoping;Nevil Shane C.;Buchberger, Jr. Douglas A. |
分类号 |
B23K10/00;B23B31/28;H01L21/67;H01L21/683;H05H1/46;B23Q3/15 |
主分类号 |
B23K10/00 |
代理机构 |
Blakley, Sokoloff, Taylor & Zafman LLP |
代理人 |
Blakley, Sokoloff, Taylor & Zafman LLP |
主权项 |
1. A chuck assembly for supporting a workpiece during a manufacturing operation, the chuck assembly comprising:
a top surface of a dielectric layer to support the workpiece; a cooling channel base disposed beneath the top surface; a base plate disposed beneath the cooling channel base; and a thermal break disposed within the cooling channel base and extending into the base plate. |
地址 |
Santa Clara CA US |