| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing-die-bonding tape which has good dicing processability, maintains the ease of pickup for semiconductor chips after dicing, and suppresses contamination such as whisker-like sawdust generated on a cutting surface after dicing and generations of fracture (so-called film crack) in a non-adhesive layer as a release liner after dicing.SOLUTION: A dicing-die-bonding tape comprises a dicing film; a non-adhesive layer stacked on the dicing film; and an adhesive layer for die-bonding stacked on the non-adhesive layer, and has a storage elastic modulus of the non-adhesive layer of 0.5 to 3 GPa and a rupture elongation of 100 to 400%.SELECTED DRAWING: Figure 1 |
