| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in the characteristics generally required for a radiation-sensitive resin composition such as radiation sensitivity and storage stability and suitably usable for the formation of a cured film excellent in developability, solvent resistance and wiring corrosion.SOLUTION: Provided is a radiation-sensitive resin composition comprising: a polymer [A] including a structural unit having at least either a hydroxyl group or a carboxyl group; a radiation-sensitive compound [B]; and a boron compound [C]. As the boron compound [C], a compound represented by formula (1) or a compound with a partial structure represented by formula (2) is preferable. Rand Rdenote a hydrogen atom, a 1 to 20C alkyl group, a 6 to 20C aryl group, a 7 to 13C aralkyl group or a trialkylsilyl group. Rdenotes a hydrogen atom, a 1 to 20C alkyl group or a 1 to 20C alkoxy group.SELECTED DRAWING: None |
