| 摘要 |
PROBLEM TO BE SOLVED: To provide a direct-drawing type exposure apparatus that can carry out pattern exposure while the optical axis of an exposure beam is orthogonal to an exposure surface of a photosensitive resin.SOLUTION: The direct-drawing type exposure apparatus carries out pattern exposure by directly irradiating a photosensitive resin PP in a film state held by a substrate B with an exposure beam 1b, and the apparatus includes: a light source 1 that outputs the exposure beam 1b; a base 2; positioning members 3a to 3d that determine a height position of the substrate B during exposure; displacement mechanisms 5a to 5d that interlock and operate; and support shafts 8a to 8d that support the substrate B on the base 2 and can deform or displace in response to an axial stress. The substrate B is set at a height position where the optical axis of the exposure beam 1b and an upper surface of the substrate B are orthogonal to each other, while an edge region on the upper surface of the substrate B or an upper surface of the photosensitive resin PP is brought into contact with lower surfaces of the positioning members 3a to 3d and at least one of the support shafts 8a to 8d is deformed or displaced by a stress induced in the axial direction of the support shaft by the contact.SELECTED DRAWING: Figure 1 |
