发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of improving plasma controllability in a circumferential direction in a plasma processing chamber.SOLUTION: A plasma processing apparatus comprises: a plasma generation unit for generating plasma; a helical coil wound around outside of the plasma generation unit; a high-frequency power supply for supplying high-frequency power to the helical coil; and a processing unit for processing a sample by the plasma. In the plasma processing apparatus, the plasma generation unit has a dome shape, and the helical coil has a first helical coil, a second helical coil, and a third helical coil. The plasma processing apparatus comprises a phase controller that controls a phase difference between high-frequency power respectively supplied to the first and second helical coils, a phase difference between high-frequency power respectively supplied to the second and third helical coils, and a phase difference between high-frequency power respectively supplied to the third and first helical coils to a predetermined angle, respectively.SELECTED DRAWING: Figure 1
申请公布号 JP2016018727(A) 申请公布日期 2016.02.01
申请号 JP20140141882 申请日期 2014.07.10
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 OGAWA YOSHIFUMI;NISHIO RYOJI
分类号 H05H1/46;C23C16/507;H01L21/3065 主分类号 H05H1/46
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