发明名称 THREE-DIMENSIONAL MOLDING DEVICE AND WIRE PENETRATION MECHANISM UNIT
摘要 PROBLEM TO BE SOLVED: To provide a three-dimensional molding device capable of molding a cubic molding in which deterioration in mechanical strength is suppressed by increasing interlayer adhesion.SOLUTION: Provided is a three-dimensional molding device 1 where a process of curing a molding material discharged from a material discharge means 21 by a curing means 22 to form a molding material layer is repeated, thus a plurality of molding material layers are laminated to mold a cubic molding on a molding stage 30. The three-dimensional molding device 1 comprises a wire penetration mechanism 31 where a wire W is penetrated to the lamination direction of a plurality of the molding material layers of the cubic molding S on the molding stage 30. The penetration mechanism 31 comprises a first roller member 312 and a second roller member 313 arranged so as to hold the wire W from the relative directions and a motor 311 at least rotatively driving the first roller member 312. The motor 311 rotatively drives the first roller member 312, thus the wire W is fed-out from a penetration hole 301 provided at the molding stage 30.SELECTED DRAWING: Figure 1
申请公布号 JP2016016540(A) 申请公布日期 2016.02.01
申请号 JP20140139042 申请日期 2014.07.04
申请人 IWATE UNIV 发明人 YAMAGUCHI MASAKI
分类号 B29C67/00 主分类号 B29C67/00
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