发明名称 ABRASIVE AND SUBSTRATE POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an abrasive and a substrate polishing method in which grains of hydroxide of tetra-valent metallic element do not aggregate even if the grains and alkali are simultaneously contained.SOLUTION: Provided is: an abrasive containing water, abrasive-grains comprising hydroxide of tetra-valent metallic element, a compound having a structure represented by a particular formula, or inositol, and an alkali; the abrasive in which the contents of the compound having a structure represented by a particular formula, or inositol, is 0.1 fold that of the content of the abrasive-grains comprising hydroxide of tetra-valent metallic element; and the abrasive in which the tetra-valent metallic element is tetra-valent cerium.SELECTED DRAWING: None
申请公布号 JP2016017150(A) 申请公布日期 2016.02.01
申请号 JP20140141372 申请日期 2014.07.09
申请人 HITACHI CHEMICAL CO LTD 发明人 MINAMI HISATAKA;IWANO TOMOHIRO;YAMAMURA NAO;AKUTSU TOSHIAKI;YAMASHITA TETSURO;KOIZUMI MASAKO
分类号 C09K3/14;B24B37/00;H01L21/304 主分类号 C09K3/14
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