| 摘要 |
The present invention relates to a halogen-free resin composition and to a prepreg and a printed circuit laminate using the same. The halogen-free resin composition comprises, with respect to 100 parts by weight of an organic solid, (A) 30-60 parts by weight of a bisphenol-type epoxy resin; (B) 5-45 parts by weight of a benzoxazine resin; (C) 10-30 parts by weight of an alkyl phenol novolac hardening agent; and (D) a phosphorus-containing flame retardant. The structure of the bisphenol-type epoxy resin has relatively many branched-chain alkyl groups and benzene rings so the halogen-free resin composition has a relatively high glass transition temperature, low absorptivity, good heat resistance and excellent dielectric performance. In addition, an alkyl phenol novolac is used as a hardening agent so the halogen-free resin composition sufficiently exhibits advantages of excellent dielectric performance and low absorptivity due to relatively many alkyl groups. A prepreg and a printed circuit laminate manufactured by using a halogen-free thermosetting resin composition have a high glass transition temperature, a low dielectric constant, a low dielectric loss factor, low absorptivity, high heat resistance, and good flame retardance, processability and chemical resistance. |
