METAL FILM, CONDUCTOR STRUCTURE FOR PRECISION MICROCOMPONENT, MEMS, ELECTRONIC PRODUCT, AND METAL FILM MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method capable of improving adhesion to a substrate to thereby obtain a metal film causing no separation from a resin substrate.SOLUTION: In a metal film manufacturing method, a substrate modification step Q for obtaining a resin substrate having a surface modified to (CH)Si-O (trimethylsiloxane) is provided after a pre-processing cleaning step P1 for a resin substrate, and thereafter, a metal material processing step P2 for allowing a metal material for forming a metal film to adhere on the resin substrate, a heat treatment step P3 subjecting the resin substrate in a metal material adhesion state to heat treatment to form the metal film, an etching step P4 subjecting the metal film to etching, and a finishing plating step P5 are provided in order.SELECTED DRAWING: Figure 1