| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability in reading a code formed on a semiconductor device.SOLUTION: A semiconductor device manufacturing method of one embodiment, includes: a process of forming encapsulated bodies MR in a plurality of device regions DVP of a wiring board in a state where a code (first identification information) MK3 is formed outside the plurality of device regions DVP; and a process of reading the code MK3 after forming the encapsulated bodies MR and forming another code (second identification information) on each encapsulated body. In addition, between a marking region MKR where the code MK3 is formed and the plurality of device regions DVP, a dam part DM is formed before the process of forming the encapsulated bodies MR.SELECTED DRAWING: Figure 16 |
