METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD

摘要

The present invention relates to a method for manufacturing a flexible printed circuit board, and a flexible printed circuit board manufactured by the method. After a substrate is heated to a front heat deformation, a circuit pattern is formed with conductive paste on one surface of the substrate. The circuit pattern is sintered. So dimension stability can be secured when the circuit pattern printed with the conductive paste is sintered. The adhesion of the circuit pattern can be stably maintained after the sintering process.