| 摘要 |
A chip carrier is supported by a thermally conductive spacer block under its center, which provides mechanical connection to the circuit board. The external contact pads on the underside of the chip carrier are not bonded directly to the traces on the board, but instead are bonded to a connecting strip, i.e. a polymer layer having conductive traces thereon, and the traces on the connecting strip are bonded to traces on the board. |
