发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To establish a plasma processing apparatus and a plasma processing method which allow for optimal control of the degree of circular polarization.SOLUTION: A plasma processing apparatus includes a reflection coefficient measuring instrument 204 provided in a circular waveguide, and measuring the reflection coefficients of a load in a processing chamber, a variable characteristic circular polarization generator 202 generating circular polarization corresponding to a change in the reflection coefficients of the load, and a controller 208 for receiving the measurement results from the reflection coefficient measuring instrument 204 as an input signal, calculating an output signal for characteristic control, and outputting to the circular polarization generator 202. The controller 208 has a storage section 207 storing a table or a numerical model for calculating the behavior of the circular polarization generator 202 for the input signal, and a circular polarization generation controller 206 outputting an output signal for varying the characteristics of the circular polarization generator 202 with reference to the table or by characteristic calculation by means of the numerical model.SELECTED DRAWING: Figure 2
申请公布号 JP2016018657(A) 申请公布日期 2016.02.01
申请号 JP20140140414 申请日期 2014.07.08
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 TAMURA HITOSHI;TETSUKA TSUTOMU
分类号 H05H1/46;H01L21/3065;H05H1/00 主分类号 H05H1/46
代理机构 代理人
主权项
地址