SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor module which is fail-safe, high in reliability and inexpensive.SOLUTION: A semiconductor module 10 comprises: a substrate 14 on a base plate 12; a housing 16 which is attached to the base plate 12 and at least partially encloses the substrate 14; and at least one terminal 34 whose one end protrudes from the housing 16 and whose another end has a terminal leg part 36, the terminal leg part 36 being attached onto a terminal pad 38 of a metal coating 28 by ultrasonic welding. A protection wall 42 enclosing the terminal 34 divides an internal space 22 of the housing 16 into a non-protected area 46 and a protected area 44. The protection wall 42 is formed in such a manner that a gap 48 is formed between the substrate 14 and the protection wall 42. The gap 48 is designed so as to carry a flow 60 of fluid in such a manner that particles produced at the time of ultrasonic welding of the terminal leg part 36 to the terminal pad 38 are prevented from entering into the protected area 44 from the non-protected area 46.SELECTED DRAWING: Figure 3