DICING TAPE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To quickly flatten a recessed portion of a wafer having the recessed portion.SOLUTION: A dicing tape 20 includes a compensation layer 23x to be stuck on a bottom face S1a of a recessed portion V1 of a wafer 100. The compensation laye 23x has a disc-like shape so that the compensation laye 23x is embedded into the recessed portion V1. The thickness TH1 of the compensating layer 23x is the same as the depth d1 of the recessed portion V1. The dicing tape 20 is stuck on the wafer 100 for dicing the wafer 100 having the recessed portion V1.SELECTED DRAWING: Figure 2