| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of applying laser beam machining to a workpiece without being affected by scattered debris.SOLUTION: The laser beam machining apparatus is provided which includes a workpiece holding means and laser beam irradiation means 5 provided with a collector for irradiating the workpiece held by the workpiece holding means with a laser beam. The laser beam machining apparatus further includes a debris discharge mechanism 7 which sucks debris scattered by irradiation of the workpiece with laser beam emitted from the collector 51 and includes debris discharge means 72. The debris discharge means 72 includes: a negative pressure generation cylinder body 721 which is arranged in a suction passage and is provided with a plurality of negative pressure generation air ejection passages for ejecting air obliquely toward an inner circumferential surface from an outer circumferential surface thereby generating a negative pressure on a workpiece side opening part; an annular groove which is provided in the suction passage and is communicated with a plurality of negative pressure generation air ejection passages formed in the negative pressure generation cylinder body; and an air supply passage 722 which generates a negative pressure and is communicated with the annular groove and is communicated with an air supply means 723 for generating a negative pressure.SELECTED DRAWING: Figure 6 |
