发明名称 |
ELECTRONIC DEVICE, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND MOBILE BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device having high mechanical strength, a manufacturing method of the electronic device, an electronic module, an electronic apparatus, and a mobile body.SOLUTION: An electronic device 1 includes: a package 10 which has a base substrate 2 and a lid body 3 and in which an internal space S is formed between the base substrate 2 and the lid body 3; and a function element 4 disposed in the internal space S. The lid body 3 has a communication hole 33 which allows the interior and the exterior of the internal space S to communicate with each other. At least a part of a periphery of an internal space S side opening 33a of the communication hole 33 is joined to the base substrate 2.SELECTED DRAWING: Figure 5 |
申请公布号 |
JP2016018949(A) |
申请公布日期 |
2016.02.01 |
申请号 |
JP20140142128 |
申请日期 |
2014.07.10 |
申请人 |
SEIKO EPSON CORP |
发明人 |
NARUSE ATSUNORI |
分类号 |
H01L23/02;G01P15/125;G01P15/18;H01L29/84 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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