发明名称 CONNECTION STRUCTURE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a connection structure for an electronic component allowing the electronic component to be attached to a more exact position.SOLUTION: In a connection structure, a mold bus bar is formed by molding two bus bars 10, 20 with a resin portion 30. The resin portion 30 is provided with an opening 31, and connection parts 11, 21 of the bus bars 10, 20 are exposed inside the opening 31. The connection parts 11, 21 are provided with projections 12, 22. Positioning parts 32, 33 are integrally formed on an inner surface of the opening. A shunt resistor 40 is disposed so as to bridge two connection parts 11, 21. The shunt resistor 40 is sandwiched by the positioning parts 32, 33 in an X direction and held by the projections 12, 22 in a Y direction. When the shunt resistor 40 is attached by welding or the like, movement in an XY plane can be suppressed, therefore, the shunt resistor 40 can be precisely attached to the bus bars 10, 20.SELECTED DRAWING: Figure 1
申请公布号 JP2016018932(A) 申请公布日期 2016.02.01
申请号 JP20140141595 申请日期 2014.07.09
申请人 JTEKT CORP 发明人 YAMASHITA MANABU;TANINAGA TAKASHI
分类号 H05K3/34;H02G1/14;H05K7/06 主分类号 H05K3/34
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