| 摘要 |
PROBLEM TO BE SOLVED: To provide a production method technique for an exposure mask used upon the cutting of a wafer at a low cost by a simple process compared with the conventional method.SOLUTION: Provided is a method for producing an exposure mask for wafer working, comprising: a groove formation step where, in a transparent plate 21 having a size more than that of the wafer to be worked and transmitting light, a groove 23 with a depth not reaching the back surface of the transparent plate is formed on the region on the side of the surface 21a corresponding to the street of the wafer; and a light shielding material burying step where a light shielding material 27 having light shielding properties is buried in the groove.SELECTED DRAWING: Figure 3 |
