| 摘要 |
PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition for laminate, which can decrease an amount of powder generated after punching fabrication of a printed circuit board; a prepreg using the same; a laminate for a printed circuit board; and a multilayer printed circuit board.SOLUTION: A thermosetting resin composition for laminate comprises (A) a thermosetting resin having a dihydrobenzoxazine ring, (B) a polycondensate of phenols, a compound having a triazine ring, and aldehydes, (C) a phenol novolac-type epoxy resin, (D) a condensed phosphate-type flame retardant, (E) a phenoxy resin, and (F) an inorganic filler. The total amount of the thermosetting resin composition for laminate comprises 20 to 40 mass% of (A), 10 to 30 mass% of (B), 20 to 40 mass% of (C), 5 to 35 mass% of (D), and 1 to 15 mass% of (E); and relative to a total of 100 pts.mass of (A) to (E), 10 to 100 pts.mass of the (F) inorganic filler is contained.SELECTED DRAWING: None |
