| 摘要 |
PROBLEM TO BE SOLVED: To prevent pattern collapse due to substrate cleaning treatment.SOLUTION: A pattern formation method using ink jetting is used as a method for forming a circuit pattern during a manufacturing process of a semiconductor or photomask. In the pattern formation method, a pattern is formed by applying a patterning material jetted from an ink-jet discharge nozzle for forming the circuit pattern. The pattern formation method can form a pattern such that an aspect ratio of the pattern becomes lower as a pattern dimension becomes finer, so that pattern collapse due to substrate cleaning treatment can be prevented.SELECTED DRAWING: Figure 1 |
