| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of a power conversion system which improves reliability while reducing cost by efficiently and easily reducing temperature rising of an electrification pattern of a printed circuit board.SOLUTION: The cooling structure is used normally as a substrate packaged terminal block for a power semiconductor module (power conversion system) mounted on a rear side in order to cool the power conversion system. The cooling structure is used while being screwed in such a manner that the cooling structure is inverted and mounted on the printed circuit board as a terminal block 3 that uses a terminal as a radiation fin and/or the terminal block is formed in an irregular shape (e.g., a radiator plate opening the top outwards) and made into a substrate mounting table 4 for heat radiation.SELECTED DRAWING: Figure 3 |
