PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to a printed circuit board and a method for manufacturing the same. According to one embodiment of the present invention, the printed circuit board includes: a first insulating layer; a second insulating layer formed in a lower part of the first insulating layer; a via pad formed on an upper surface of the second insulating layer to be buried in the second insulating layer; a double via formed on an upper surface of the via pad to penetrate the first insulating layer and including an auxiliary via and a first via; and a second via formed on a lower surface of the via pad to penetrate the second insulating layer.