THERMOFORMABLE MULTILAYER FILMS AND BLISTER PACKS PRODUCED THEREFROM

摘要

A MULTI-LAYER FILM STRUCTURE (10) FOR USE IN FORMING BLISTER PACKAGING INCLUDES A FIRST POLYMERIC LAYER (12) HAVING A FIRST SURFACE (14) AND A SECOND SURFACE (16), THE FIRST POLYMERIC LAYER COMPRISING A METALIZED POLYETHYLENE TEREPHTHALATE. THE MULTI-LAYER STRUCTURE ALSO INCLUDES A SECOND POLYMERIC LAYER (24) HAVING A FIRST SURFACE (26) AND A SECOND SURFACE (28), THE FIRST SURFACE OF THE SECOND POLYMERIC LAYER DISPOSED ADJACENT THE SECOND SURFACE OF THE FIRST POLYMERIC LAYER, THE SECOND POLYMERIC LAYER COMPRISING A CYCLIC OLEFIN OR A HOMOPOLYMER OF CHLOROTRIFLUOROETHYLENE. THE MULTI-LAYER STRUCTURE FURTHER INCLUDES A THIRD POLYMERIC LAYER (36) HAVING A FIRST SURFACE (38) AND A SECOND SURFACE (40), THE FIRST SURFACE OF THE THIRD POLYMERIC LAYER DISPOSED ADJACENT THE SECOND SURFACE OF THE SECOND POLYMERIC LAYER, THE THIRD POLYMERIC LAYER COMPRISING POLYPROPYLENE OR POLYVINYL CHLORIDE. A METHOD OF MAKING A MULTI-LAYER FILM STRUCTURE AND A THERMOFORMED BLISTER PACKAGE (100) ARE ALSO PROVIDED.