发明名称 |
PROCEDE DE MONTAGE DE COMPOSANTS ELECTRONIQUES OU ELECTRIQUES SUR UN SUPPORT DE CIRCUIT CONDUCTEUR D'ELECTRICITE |
摘要 |
<p>The invention relates to a method of connecting electrical or electronic components equipped with electrical contacts (5) to a support (2) comprising an electrically conductive circuit (3). According to the invention: the electrically conductive circuit is produced by moulding an electrically conductive thermoplastic polymer; a housing (10) is provided at least partly in the electrically conductive circuit (3); the component (1) is prepositioned in the housing (10) by placing the electrical contacts (5) at least partly in contact with said electrically conductive circuit; the electrical contacts of the component (1) are placed in contact with the electrically conductive circuit (3); and at least the component (1) is subjected to ultrasonic vibration so as to solder the contacts (5) of the component (1) to the electrically conductive circuit.</p> |
申请公布号 |
FR2961057(B1) |
申请公布日期 |
2016.01.29 |
申请号 |
FR20100054332 |
申请日期 |
2010.06.03 |
申请人 |
NIEF PLASTIC |
发明人 |
GIRODON MARLENE;MULLER DIDIER |
分类号 |
H05K3/34;B23K20/10 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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