| 摘要 |
A substrate processing apparatus comprises a chuck for supporting each substrate and a chemical supplying device. The chemical supplying device comprises a chemical storing part, a chemical injecting part, and a chemical heating part. The chemical storing part stores a chemical injected toward the substrate. The chemical injecting part is connected to the chemical storing part in order to inject the chemical supplied from the chemical storing part toward the substrate. The chemical heating part can heat the chemical stored in the chemical storing part to have at least two temperature conditions. |
