| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that provides a cured product or a molded product having excellent adhesion to metal and inorganic materials.SOLUTION: The present invention provides a resin composition comprising an imidazole silane compound represented by chemical formula (I), and resin (where R-Rare H, a C1-20 alkyl group or a phenyl group; Rand Rare H or a C1-3 alkyl group; m is an integer of 1-3; n is an integer of 0-5). |
