METHOD OF AND APPARATUS FOR CMP PAD CONDITIONING

摘要

A chemical mechanical polishing (CMP) apparatus is provided that includes a conditioning disc for conditioning a polishing pad of the CMP apparatus. The conditioning disc includes a plurality of portions of subsystem discs. The portions may be regions of the disc that are concentric. Each portion of the disc is operable to rotate at a different angular velocity. In some embodiments, a different applied loading is provided to each of the portions of the disc in addition to or in lieu of the different angular velocities.

主权项

1. A method, comprising:
providing a conditioning disc for conditioning a polishing pad of a chemical mechanical polish (CMP) apparatus, wherein the conditioning disc includes a first subsystem disc and a concentric second subsystem disc; providing a dresser head coupled to the conditioning disc, wherein a first portion of the dresser head and the first subsystem disc define a first integral piece, and wherein a second portion of the dresser head and the second subsystem disc define a second integral piece; applying, by a controller in communication with the dresser head, a first force to the first subsystem disc using the integral first portion of the dresser head; and applying, by the controller in communication with the dresser head, a second force to the second subsystem disc using the integral second portion of the dresser head while applying the first force, the second force being different than the first force.