LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

摘要

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.

主权项

1. A lead-free, antimony-free solder alloy comprising:
(a) 3 to 5 wt % of silver (b) 2.5 to 5 wt % of bismuth (c) 0.3 to 2 wt % of copper (d) at least one of the following elements
up to 1 wt. % of nickelup to 1 wt. % of titaniumup to 1 wt. % of cobaltup to 3.5 wt. % of indiumup to 1 wt. % of zincup to 1 wt. % of arsenic (e) optionally one or more of the following elements 0 to 1 wt. % of manganese 0 to 1 wt. % of chromium 0 to 1 wt. % of germanium 0 to 1 wt. % of iron 0 to 1 wt. % of aluminum 0 to 1 wt. % of phosphorus 0 to 1 wt. % of gold 0 to 1 wt. % of gallium 0 to 1 wt. % of tellurium 0 to 1 wt. % of selenium 0 to 1 wt. % of calcium 0 to 1 wt. % of vanadium 0 to 1 wt. % of molybdenum 0 to 1 wt. % of platinum 0 to 1 wt. % of magnesium 0 to 1 wt. % of rare earths (f) the balance tin, together with any unavoidable impurities; wherein the alloy affirmatively contains said Ni in a concentration of 0.01 to 1 wt %; and wherein the alloy affirmatively contains said Ge in a concentration of 0.005 to 1.