COPPER BONDING WIRE WITH ANGSTROM (A) THICK SURFACE OXIDE LAYER

摘要

A copper wire having a diameter of 10 to 80 μm, wherein the copper wire bulk material is ≥ 99.99 wt.-% pure copper or a copper alloy consisting of 10 to 1000 wt.-ppm of silver and/or of 0.1 to 3 wt.-% of palladium with copper as the remainder to make up 100 wt.- %, characterized in that the copper wire has a 0.5 to < 6 nm thin circumferential surface layer of copper oxide.