发明名称 |
FORMING SELF-ALIGNED CONDUCTIVE LINES FOR RESISTIVE RANDOM ACCESS MEMORIES |
摘要 |
Resistive random access memory elements, such as phase change memory elements, may be defined using a plurality of parallel conductive lines over a stack of layers, at least one of which includes a resistive switching material. The stack may be etched using the conductive lines as a mask. As a result, memory elements may be self-aligned to the conductive lines. |
申请公布号 |
US2016028002(A1) |
申请公布日期 |
2016.01.28 |
申请号 |
US201514876540 |
申请日期 |
2015.10.06 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
TORTORELLI INNOCENZO;PELLIZZER FABIO;PETRUZZA PIETRO |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method, comprising:
forming a stack, wherein the stack includes a barrier layer; forming a first plurality of trenches and a second plurality of trenches in the barrier layer, wherein trenches of the first plurality of trenches are spaced from each other by trenches of the second plurality of trenches; filling the first plurality of trenches with a dielectric material; filling the second plurality of trenches with metal; and using said metal as a hard mask, removing said stack to form a plurality of stacks separated by the second plurality of trenches. |
地址 |
BOISE ID US |