发明名称 |
METHODS, SYSTEMS, AND APPARATUSES FOR TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE DEVICE |
摘要 |
<p>Embodiments described herein provide a temperature-compensated surface acoustic wave (TCSAW) device, a method of fabricating a TCSAW device, and a RF transceiver incorporating a TCSAW device. The TCSAW device includes a piezoelectric substrate (104), a plurality of electrodes (108) formed on a first surface of the piezoelectric substrate (104), an amorphous silicon layer (128) formed over the plurality of electrodes (108), and a temperature compensating layer (124) formed over the amorphous silicon layer (128).</p> |
申请公布号 |
WO2016014416(A1) |
申请公布日期 |
2016.01.28 |
申请号 |
WO2015US41152 |
申请日期 |
2015.07.20 |
申请人 |
TRIQUINT SEMICONDUCTOR, INC. |
发明人 |
STEINER, KURT;HELLA, CURTISS;ABBOTT, BENJAMIN, P.;CHESIRE, DANIEL;THOMPSON, CHAD;CHEN, ALAN, S. |
分类号 |
H03H3/10;H03H9/02;H03H9/13 |
主分类号 |
H03H3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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