发明名称 |
PRE-APPLIED UNDERFILL |
摘要 |
Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first filled polymer region having a first viscosity and a second filled polymer region having a second viscosity, wherein the first viscosity is less than the second viscosity. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill. |
申请公布号 |
SG10201504961W(A) |
申请公布日期 |
2016.01.28 |
申请号 |
SG10201504961W |
申请日期 |
2015.06.23 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
ROBERT K. BARR;EDGARDO ANZURES;JEFFREY M. CALVERT;HERONG LEI;DAVID FLEMING;AVIN V. DHOBLE;ANUPAM CHOUBEY |
分类号 |
B32B7/06;B32B7/12;B32B27/00;H01L21/00;H01L23/29 |
主分类号 |
B32B7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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