| 摘要 |
971,703. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. May 18, 1961 [May 18, 1960], No. 18240/61. Heading H1K. Stresses produced by the heating and cooling of a semi-conductor device provided with electrodes 2, 3 which may be of molybdenum when the electrodes are in contact with heat radiating members of different coefficient of expansions are avoided by clamping the electrodes between heat dissipating members 4, 5 which extend over the entire surface of the device. As shown, members 4, 5 which are of copper and carry cooling fins 9 are held together by screws 6 passing through insulating bushes 11. Spring washers may be provided and to avoid the necessity for precision machining of the adjacent copper and molybdenum surfaces, a metal foil may be clamped between them. The edges of the device may be surrounded by a protective resin or glass or encased in a resilient metallic case with an insulating insert in its wall. The casing may be gas-filled. In a further arrangement (Fig. 6), diaphragm members 17, 18 are soldered to the metallised ends of an insulating insert 16. |
